Meyer Burger awarded important contract for over CHF 10 million for its newest generation DW288 Series 3 diamond wire saws.
The newly launched DW288 Series 3 diamond wire cutting technology from Meyer Burger has been selected for the manufacture of high performance mono-crystalline silicon solar wafers by yet another existing photovoltaic customer in Asia.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) today announced that it has received an important contract from a manufacturer of mono-crystalline solar wafers in Asia for its new generation DW288 Series 3 diamond wire based silicon wafer cutting equipment. The customer plans to expand its production volume of mono-crystalline wafers to support the increasing demand for its high quality solar wafers. The contract value is over CHF 10 million. Delivery and commissioning of the systems is scheduled for the second half of 2016.
The DW288 Series 3 is the newest generation of Meyer Burger’s successful diamond wire cutting technology which was introduced to the market at the beginning of 2016. Since its launch, Meyer Burger has provided the photovoltaic market with a total of over 2.0 gigawatts of cutting capacity reflecting substantial orders for the DW288 Series 3.
With its newest generation of its environmentally friendly, water-based diamond wire cutting technology, Meyer Burger continues to significantly reduce manufacturing costs for solar wafers while gaining a significant share of the growing mono-crystalline silicon market.
